H3C UniServer R4700 G3 Server

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        H3C UniServer R4700 G3 Server

        Handle high-density workloads with excellent performance and extraordinary efficiency

        The R4700 G3 provides enhanced performance in high-density scenarios and delivers extraordinary computing performance with Intel processors in a 1U space. Its industry-leading system design brings ease of use, enhanced security, and high availability.

        As an advanced high-performance dual-processor 1U rack server, the R4700 G3 uses the most recent Intel® Xeon® Scalable processors and six-channel 2933MHz DDR4 DIMMs, increasing server performance by 50%. With GPU acceleration and NVMe SSD, the R4700 G3 provides excellent computing performance and I/O acceleration. Its support of power supplies with 96% efficiency and an operating temperature as high as 45°C (113°F) greatly improves data center efficiency and brings high return on investment.

        The R4700 G3 is ideal for high-density scenarios:

        - High-density data centers – For example, data centers of medium- to large-sized enterprises and service providers.

        - Dynamic load balancing – For example, database, virtualization, private cloud, and public cloud.

        - Compute-intensive applications – For example, Big Data, smart commerce, and geological prospecting and analysis.

        - Low-latency and online trading applications – For example, querying and trading systems of the financial industry.

        The R4700 G3 supports Microsoft® Windows® and Linux operating systems, as well as VMware and H3C CAS and can operate perfectly in heterogeneous IT environments.

        Excellent performance improves data center productivity

        Support the most up-to-date tech platforms and massive memory expansion

        Support high-performance GPU acceleration

        Scalable configuration protects IT investment

        Flexible subsystem selection

        Modular design that allows phased investment

        Comprehensive security protection

        Indigenous chip-level encryption

        Security bezel, chassis lock, and chassis intrusion monitoring

        Computing

        2 × Intel® Xeon® Scalable processors

        (Up to 28 cores and maximum 205 W power consumption)

        Memory

        3.0 TB (maximum)

        24 × DDR4 DIMMs

        (Up to 2933 MT/s data transfer rate and support for both RDIMM and LRDIMM)

        (Up to 12 Intel ® Optane™ DC Persistent Memory Module.(DCPMM)

        Storage controller

        Embedded RAID controller (SATA RAID 0, 1, 5, and 10)

        Mezzanine HBA card (SATA/SAS RAID 0, 1, and 10) (Optional)

        Mezzanine storage controller (RAID 0, 1, 5, 6, 10, 50, 60, and 1E) (Optional)

        Standard PCIe HBA cards and storage controllers (Optional)

        FBWC

        4 GB DDR4-2133MHz

        Storage

        Front 4LFF + rear 2SFF or front 10SFF + rear 2SFF (supports SAS/SATA HDD/SSD and up to 8 front NVMe drives)

        480 GB SATA M.2 SSDs

        Network

        1 × onboard 1 Gbps management network port

        1 × mLOM Ethernet adapter that provides 4 × 1GE copper ports or 2 × 10GE copper/fiber ports (Optional)

        1 × PCIe Ethernet adapters (Optional)

        PCIe slots

        5 × PCIe 3.0 slots (two standard slots, one optional front slot, one for Mezzanine storage controller, and one for Ethernet adapter)

        Ports

        Front VGA connector (Optional)

        Rear VGA connector and serial port

        4 × USB 3.0 connectors (two at the rear and two in the server)

        2 × MicroSD slots (Optional)

        GPU

        2 × single-slot wide GPU modules

        Optical drive

        External optical drive

        Only the 4LFF and 8SFF drive models support built-in optical drives

        Management

        HDM (with dedicated management port) and H3C FIST

        Power supply and ventilation

        Platinum 550W/800W/850W/1200W1600W, Titanium, or 800W –48V/336V DC power supplies (1+1 redundancy)

        Hot swappable fans (supports redundancy)

        Standards

        CCC, CECP, SEPA,CE,UL,EAC etc.

        Operating temperature

        5°C to 45°C (41°F to 113°F)

        The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device.

        Dimensions (H × W × D)

        Without a security bezel: 42.88 × 434.59 × 768.3 mm (1.69 × 17.11 × 30.25 in)

        With a security bezel: 42.88 × 434.59 × 780.02 mm (1.69 × 17.11 × 30.71 in)

        Warranty

        Three years

        Next-business-day response, 5×9

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