H3C UniServer R4700 G3 Server

        HomeProducts & TechnologyEnterprise ProductsServersH3C UniServer R4700 G3 Server
        R4700 G3 Front View with Bazel
        R4700 G3 LFF
        R4700 G3 Rear View
        R4700 G3 SFF

        Handle high-density workloads with excellent performance and extraordinary efficiency

        The R4700 G3 provides enhanced performance in high-density scenarios and delivers extraordinary computing performance with Intel processors in a 1U space. Its industry-leading system design brings ease of use, enhanced security, and high availability.

        As an advanced high-performance dual-processor 1U rack server, the R4700 G3 uses the most recent Intel® Xeon® Scalable processors and six-channel 2933MHz DDR4 DIMMs, increasing server performance by 50%. With GPU acceleration and NVMe SSD, the R4700 G3 provides excellent computing performance and I/O acceleration. Its support of power supplies with 96% efficiency and an operating temperature as high as 45°C (113°F) greatly improves data center efficiency and brings high return on investment.

        The R4700 G3 is ideal for high-density scenarios:

        - High-density data centers – For example, data centers of medium- to large-sized enterprises and service providers.

        - Dynamic load balancing – For example, database, virtualization, private cloud, and public cloud.

        - Compute-intensive applications – For example, Big Data, smart commerce, and geological prospecting and analysis.

        - Low-latency and online trading applications – For example, querying and trading systems of the financial industry.

        The R4700 G3 supports Microsoft® Windows® and Linux operating systems, as well as VMware and H3C CAS and can operate perfectly in heterogeneous IT environments.

        Excellent performance improves data center productivity

        Support the most up-to-date tech platforms and massive memory expansion

        Support high-performance GPU acceleration

        Scalable configuration protects IT investment

        Flexible subsystem selection

        Modular design that allows phased investment

        Comprehensive security protection

        Indigenous chip-level encryption

        Security bezel, chassis lock, and chassis intrusion monitoring


        2 × Intel® Xeon® Scalable processors

        (Up to 28 cores and maximum 205 W power consumption)


        3.0 TB (maximum)

        24 × DDR4 DIMMs

        (Up to 2933 MT/s data transfer rate and support for both RDIMM and LRDIMM)

        (Up to 12 Intel ® Optane™ DC Persistent Memory Module.(DCPMM)

        Storage controller

        Embedded RAID controller (SATA RAID 0, 1, 5, and 10)

        Mezzanine HBA card (SATA/SAS RAID 0, 1, and 10) (Optional)

        Mezzanine storage controller (RAID 0, 1, 5, 6, 10, 50, 60, and 1E) (Optional)

        Standard PCIe HBA cards and storage controllers (Optional)


        4 GB DDR4-2133MHz


        Front 4LFF + rear 2SFF or front 10SFF + rear 2SFF (supports SAS/SATA HDD/SSD and up to 8 front NVMe drives)

        480 GB SATA M.2 SSDs


        1 × onboard 1 Gbps management network port

        1 × mLOM Ethernet adapter that provides 4 × 1GE copper ports or 2 × 10GE copper/fiber ports (Optional)

        1 × PCIe Ethernet adapters (Optional)

        PCIe slots

        5 × PCIe 3.0 slots (two standard slots, one optional front slot, one for Mezzanine storage controller, and one for Ethernet adapter)


        Front VGA connector (Optional)

        Rear VGA connector and serial port

        4 × USB 3.0 connectors (two at the rear and two in the server)

        2 × MicroSD slots (Optional)


        2 × single-slot wide GPU modules

        Optical drive

        External optical drive

        Only the 4LFF and 8SFF drive models support built-in optical drives


        HDM (with dedicated management port) and H3C FIST

        Power supply and ventilation

        Platinum 550W/800W/850W/1200W1600W, Titanium, or 800W –48V/336V DC power supplies (1+1 redundancy)

        Hot swappable fans (supports redundancy)


        CCC, CECP, SEPA,CE,UL,EAC etc.

        Operating temperature

        5°C to 45°C (41°F to 113°F)

        The maximum operating temperature varies by server configuration. For more information, see the technical documentation for the device.

        Dimensions (H × W × D)

        Without a security bezel: 42.88 × 434.59 × 768.3 mm (1.69 × 17.11 × 30.25 in)

        With a security bezel: 42.88 × 434.59 × 780.02 mm (1.69 × 17.11 × 30.71 in)


        Three years

        Next-business-day response, 5×9

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